High-Airflow Electronics Enclosure

High-Airflow Electronics Enclosure

What

  • Engineered a compact protective housing for electronics, designed for efficient thermal management.
  • Developed a rectangular body with dense ventilation grilles, internal rails for easy opening and a hexagonal aperture for a standard cooling fan.

How

  • Used Fusion 360 pattern and cut tools to create hexagonal mesh that maximises airflow while keeping the walls strong.
  • Added faceted corners with broad fillets and chamfers for impact resistance and a clean industrial look.

Results

  • Delivered a model optimised for FDM printing, with clear airflow paths that prevent overheating in sustained use.
  • Produced a design that combines protection with cooling, including precise mounts for internal hardware and an external fan.

Tools and processes: Fusion 360, thermal design, hexagonal venting, FDM printing